Variable Frequency Microwave Oven

Benefits of VFM Technology

Benefits of Rapid Heating
  • Increased Throughput Potential
  • Reduction in Work In Process Inventory (QC)
  • Reduced Thermal Budget (Parts time @ Temp.)
  • Fast Cure Minimizes Part Movement
Benefits of Selective Heating
  • Reduced Stress Build-up (CTE Mismatch)
  • Enhances Selection of Materials / Design
  • Reduced Thermal Budget on Adjacent Components
Benefits of Low Temperature
  • Stay below temperature threshold of devices
  • Low thermal stress and warpage
Benefits of Precise Cycle Control
  • Cycle Optimization thru Stepped Profile

VFM Applications Markets

Application Convection VFM
Flip Chip 30 mins ~ 2 hrs 2 mins ~ 10 mins
Glob Top 1 hr ~ 2 hrs 5 mins ~ 10 mins
Post Mold Cure 4 hrs ~ 6 hrs 15 mins ~ 20 mins
Wafer Coating 4 hrs ~ 8 hrs 20 mins ~ 60 mins
Flex Coating 4 hrs ~ 5 hrs 10 mins ~ 20 mins
Smart Card 6 hrs ~ 12 hrs 2 mins ~ 5 mins
Die Attach 1 hr ~ 2 hrs 5 mins ~ 10 mins
Optical 1 hr ~ 2 hrs 10 mins ~ 15 mins
Ceramics 1 day ~ 7 days 20 mins ~ 4 hrs

Flip Chip Underfill Selective Heating

BGA - Ceramic Chip Carrier -in metalic boat-

Structural Bonding Applications
-in electronic packaging-

Advantages
  • Selective Heating of the Bond line
  • Rapid cure Cycles
Applications
  • Plastic to Plastic**
  • Glass to Plastic**
  • Ceramic to Metal**
  • Die Attach
Materials
  • **Doped Adhesives

Structural Adhesive Curing

Need for selective heating
  • The material can be tailored
  • Rapid Curing of Adhesive
  • Use of Cheaper Materials